Inquiry Basket (
Home » Product List » Others » Copper Clad Laminate (XPC)
Product Details
Copper Clad Laminate (XPC)
| Packing: | Cartoon & Pallet |
|---|---|
| Model NO.: | XPC |
| Unit Price: | Negotiable |
| Shipment Terms: | FOB, CIF or Others |
| Payment Terms: | L/C, T/T or Others |
| Price Valid Time: | From Aug 12,2011 To Aug 01,2012 |
| Trademark: | Redsun |
| Origin: | China |
| Export Markets: | North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe |
Product Description
XPC Copper Clad Laminate /CCL consist of bleached wood pulp paper, impregnated with modified phenolic resin and clad with electrolytic copper foil. It has high dimension stability, good punching behavior at low temperature, high thermal resistance and are widely used for computers, telephones, Hi-Fi acoustic devices, electronic toys and etc.
Normal Thickness: 1.0mm, 1.2mm, 1.5mm, 1.6mm
Size Available: 1030mmX1230mm
| No. | Item | Unit | Conditioning | Normal Value | Typical Value |
| 1 | Solder float at 260C, min. | s | A | 10 | 15 |
| 2 | Peel strength min. | N/mm |
A S-5S/260C |
- 1.0 |
1.4 1.2 |
| 3 | Flexural strength min. | MPa | A | 80 | 100 |
| 4 | Water absorption max. | % | E-24/50+D-24/23 | - | 1.8 |
| 5 | Dissipation factor max. | - |
C-96/20/65 C-96/20/65+D-48/50 |
- - |
0.05 0.10 |
| 6 | Dielectric constant max. | - |
C-96/20/65 C-96/20/65+D-48/50 |
- - |
5.5 6.0 |
| 7 | Insulation resistance min. | MΩ |
C-96/20/65 C-96/20/65+D-2/100 |
- - |
5× 10 4 50 |
| 8 | Volume resistivity min. | MΩ · m |
E-2/100 C-96/20/65+C-96/40/90 |
10 100 |
15 180 |
| 9 | Surface resistance min. | MΩ |
E-2/100 C-96/20/65+C-96/40/90 |
30 1× 10 3 |
70 1.5× 10 3 |
| 10 | Thermal resistance | - | E-1/180 | - | No blistering and peeling-off |
| 11 | Alkali resistance | - | 5%NaOH, 40° C, 5min | - |
Without notable changes in appearance |
