• Composite Materials Wave Solder Pallets
  • Composite Materials Wave Solder Pallets
  • Composite Materials Wave Solder Pallets
  • Composite Materials Wave Solder Pallets
  • Composite Materials Wave Solder Pallets
  • Composite Materials Wave Solder Pallets

Composite Materials Wave Solder Pallets

Application: Electrical Base, Shell, Motor
Type: Insulation Sheet
Material: Fiberglass & Resin
Thermal Rating: 280
Maximum Voltage: 20KV~100KV
Certification: ISO9001
Samples:
US$ 0.1/Piece 1 Piece(Min.Order)
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Customization:
Diamond Member Since 2011

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Rating: 5.0/5
Manufacturer/Factory

Basic Info.

Color
Black and Grey
Brand
Redsun
Thickness (mm)
3 to 150
Specification
1020x1220mm 1220*2440mm
Trademark
redsun
Origin
China
HS Code
3921909010
Production Capacity
50 Ton/Month

Product Description

Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Solder pallet is a heavy-duty glass fiber reinforced plastic which offers extreme strength and excellent electrical, thermal and chemical properties. It is manufactured by using Polyester, Vinyl ester, Epoxy- and modified Epoxy resins combined with glass fibers.

It can keep its mechanical strength, smoothness and original color when continuously used under the temperature of 280 ° C (max. Working temperature below 360 degree 10~20sec). It is easily machining, high intensity and can be easily machining into special mechanical parts.

Application
Solder pallet is suitable to wave soldering and SMT process. It can achieve the precision required during the SMT machining process, and maintain its flatness in the reflow soldering cycle. The low thermal conductivity of the solder pallet prevents heat-shrinkage of the bas board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallet for wave-solder applications of printed circuit boards.

The fixtures made from solder pallet has the following functions, it can improve the efficiency of the peak soldering process:
Support thin baseboard or soft substrate circuit board
Carry an irregular shape solder pallet.
Use multi-pak panel design to improve production efficiency
Prevent the deformation of the solder pallet during high temperature reflow soldering process
Smoothly surface, good endurance, applicable for Teflon spray painting.
Avoid gold finger contamination by human contact.
Protect bottom side SMT components during the wave soldering process.
Prevent the deformation of the baseboard during the wave soldering process
Standardized the width of the production lines, eliminate the width adjustment of the production line
Technical Data RDS-001 RDS-002 RDS-003
Grade   Standard      Anti-static Anti-static and Optical
Color Black      Black     Grey
Density(g/cm 3 ) 1.87 1.87 1.87
Flexural Strength(MPa)-perpendicular 3 point support(23°C)      
360 360 360
Flexural Strength(MPa)-perpendicular 3 point support(150°C)      
180 180 180
Coefficient of Linear Expansion(10 -6 / K)between30°C&200°C      
13 11 11
Thermal Conductivity(W/m 0 K)      
0.25 0.25 0.25
Surface Resistivity(ohms) ____ 10 5 -10 8 10 6 -10 8
Standard Operating Temperature(°C)      
280 280 280
Maximum Operating Temperature(°C),10-20 seconds      
360 360 360
  Thickness available(mm) 2-30        2-30 2-30
Thickness tolerance(mm) ±0.1 ±0.1 ±0.1
 Size (mm) 1020x1220
1220×2440
Thickness (mm) 3 to 150

Company InformationComposite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets
Composite Materials Wave Solder Pallets









 

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