High-Quality Wave Solder Pallets for Efficient PCB Assembly

Product Details
Customization: Available
Application: Electrical Power System, Electronic Communication, Electronic Device
Color: Grey
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Management System Certification
ISO 9001
Export Year
2009-04-09
  • High-Quality Wave Solder Pallets for Efficient PCB Assembly
  • High-Quality Wave Solder Pallets for Efficient PCB Assembly
  • High-Quality Wave Solder Pallets for Efficient PCB Assembly
  • High-Quality Wave Solder Pallets for Efficient PCB Assembly
  • High-Quality Wave Solder Pallets for Efficient PCB Assembly
  • High-Quality Wave Solder Pallets for Efficient PCB Assembly
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  • Overview
  • Product Description
  • Production Process
  • Detailed Photos
  • Packaging & Shipping
  • Company Profile
Overview

Basic Info.

Model NO.
PCB pallet
Material
Glass
Maximum Voltage
<10KV
Thermal Rating
H 180
Density
1.92
Flexural Strength
393
Transport Package
Carton/Pallet
Specification
1220*2440mm
Trademark
RDS
Origin
China
HS Code
8547909000
Production Capacity
20 Tons/Month

Product Description

Product Description

Wave Solder Pallet

Solder pallets are a kind of heavy-duty glass fiber reinforced plastic, which is made from glass fibers combined with polyester, vinylester, epoxy and modified epoxy resins, having extreme strength and excellent electrical, thermal and chemical properties, and good machinability. Normal working temperature at 280°c (max. working temperature below 360 degree 10~20sec).

Solder pallets are suitable to wave soldering and SMT process. It can achieve the precision required during SMT machining process, and maintain its flatness in reflow soldering cycle. The low thermal conductivity of durostone prevents heat-shrinkage of base board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallets for wave-solder applications of printed circuit boards.

Production Process

-Support thin baseboard or soft substrate circuit board
-Carry an irregular shape solder pallet
-Use multi-pak panel design to improve production efficiency
-Prevent the deformation of the solder pallet during high temperature reflow soldering process
-Smooth surface, good endurance, applicable for PTFE spray painting
-Avoid gold finger contamination by human contact
-Protect bottom side SMT components during the wave soldering process
-Prevent the deformation of the baseboard during the wave soldering process
-Standardize the width of production lines, eliminate the width adjustment of production line.

Detailed Photos

High-Quality Wave Solder Pallets for Efficient PCB Assembly

Packaging & Shipping

High-Quality Wave Solder Pallets for Efficient PCB Assembly

Company Profile

High-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB AssemblyHigh-Quality Wave Solder Pallets for Efficient PCB Assembly

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